严格地说，半导体是一种导电性介于绝缘体和导体之间的材料。半导体可以是单个的元素，如硅或锗，也可以是化合物，如砷化镓或磷化铟。然而，我们平常说的“半导体”多指用半导体材料制作的元件。

• 90Sr
  Strontium-90 --锶-90
• S
  Sulphur --硫
• S&A
  1) Sampling and Analysis --取样和分析
  2) Surveillance and Analysis --监督和分析
• S/S
  Stabilization/Solidification --稳定和凝固
• SA
  1) Sales Associate --销售伙伴
  2) Schottky Array --肖特基阵列
  3) Selective Availability A now obselete DoD program that controlled the accuracy of GPS pseudorange measure-ments, degrading the signal available to non-qualified receivers. --可选择获得。一种现在已经废型的DoD程序，控制GPS伪射程测试的准确度，降低没有资格认可的接收机接收信号的质量
• SADA
  1) Sales And Debit Administration --销售和借记部门
  向经销商提供定价灵活性的一种程序
  2) Ship and Debit Authorization --货运和借记授权
• SAM
  1) Served Available Market --服务可利用市场
  2) Serviceable Available Market --公司产品可以覆盖的市场部分。（参见：TAM: 整个可利用的市场）
  3)Scanning Acoustic Microscopy 4)Surface Acoustic Microscopy --扫描声显微镜
  --使用超声波对封装内部进行非破坏性成像。
• SANE
  Sulphur and Nitrogen Emissions --硫和氮的排放
• SARA
  Superfund Amendments and Reauthorization Act --超级资金修正和再授权行动
• SAS
  Sensitive AC Switch --灵敏交流开关
• SAV
  Submerged Aquatic Vegetation --水下水生植物群
• SAW
  Surface Acoustic Wave -- 声表面波
• SBS
  Silicon Bilateral Switch --硅双向开关
• SBM
  Supplier Business Manager --供应商商业经理
• SBU
  Semicustom Business Unit --半定制商务单元
• S/C
  Steering Committee --筹划指导委员会
• SCA
  Switched Capacitor Array --开关电容阵列
• Scaling --缩放比例
  一种通过选择性地缩小X和/或Y方向尺寸，减小已经存在的集成电路管芯尺寸的技术。
• Scanning Electron Microscope --扫描电子显微镜
  一种特殊的电子显微镜，在真空下使用电子束扫描一个样品，提供很高的表面放大倍数。放大倍数通常在lOx－100,OOOX之间。
• Scanning Projection Aligner --扫描投影式光刻机
  一种光学系统，使用光隙将掩模图像转换到涂有感光耐蚀材料的晶片上，光隙越过掩模进行扫描，并投影到晶片上。
• SCBA
  Self Contained Breathing Apparatus --自备氧气呼吸器
• SCC
  Serial Communication Controller --串行通信控制器
• SCFM
  Standard Cubic Feet Per Minute --标准立方英尺/分
• Schottky TTL --肖特基晶体管－晶体管逻辑电路
  一种TTL逻辑，使用肖特基二极管将晶体管钳位到饱和区外，有效消除晶体管内电荷的存储，可以提高开关速度。
• SCI
  Serial Communications Interface --串行通信接口
• SCL
  Serial Clock --串行时钟
• SCM
  Supply Chain Management --供应链管理
  一种通过流通渠道，编制计划和控制货物、现金和信息从供应商到最终用户流动的完整方法。
  * 各个公司参与从设计、生产产品到把产品交到最终用户手中的各项活动。
  * 各个公司通过网络传送商品和即时信息，该网络称为供应链或供应网络。
  *供应链的成员包括用户、供应商、运输商、销售商、供应中心和其它第三方。
• SCP
  Supply Chain Planner
  --供应链计划程序
  --编制完整生产流程计划的工具。
• SCR
  Silicon Controlled Rectifier --可控硅整流器
• SCRAP --废弃
  对产品不符合法律、法令、合同、技术要求等的决定性声明，在返工后产品不能使用或再用，必须销毁。
• Scribing --划片
  --用金刚石锯将晶片划成小片的操作。
• Scribe Line or Saw Lane --划片线或锯线
  晶片上相邻小片间的分离，将晶片锯成单独的小片时，在划片线处进行切隔。
• Scrubber --洗涤器
  使用液体喷雾来除去气流中的浮质和气态污染物质的设备。通过吸收或化学反应来除去气体，通过与喷雾的接触除去固体和液体微粒。
• SCS
  Silicon Controller Switch --硅可控开关
• SCSI
  Small Computer System(s) Interface --小型计算机系统接口
  Trademark --商标
• SCU
  Serial Communication Unit --串行通信单元
• SDC
  Secondary DC-DC Conversion --次级直流－直流转换
• SDCA CYCLE
  Standardize, Do, Check, Act --标准化，运行，检查，执行
• SDFL
  Schottky-Diode Field-effect transistor Logic --肖特基二极管　场效应晶体管逻辑
• SDH
  Synchronous Digital Hierarchy --同步数字系列
• SDI
  Strategic Defense Initiative --战略防御计划
• SDIP
  Shrink Dual In Line --小型双列直插式封装
  Package
• SDLC
  Synchronous Data-Link Control --同步数据链路控制
• SDP
  Software Data Protect --软件数据保护
• SDR
  System Design Review --系统设计回顾
  对一个设计过程和相关的技术要求进行的回顾，以便更好地计划下一个阶段。
• SDRAM
  Synchronous Dynamic Random Access Memory --同步信号动态随机存取存储器
• SDWA
  Safe Drinking Water Act --安全饮用水法案
• SEC
  Site Environmental Champion --现场环境支持
• SECAM
  Sequential Couleur a Memoire --顺序与存储电视系统
  法国彩色电视广播标准编码系统，与德国PAL系统类似，SECAM在法国和前苏联等国家使用。
• SEIA
  Socioeconomic Impact Analysis --社会经济学影响分析
  Selective Etching --选择性刻蚀
  --使得某些材料溶解，但其它材料不受刻蚀剂影响的刻蚀。
• SEM
  Scanning Electron Microscope --扫描电子显微镜
  Equipment used to analyze defects. --分析缺陷的设备
• SEMATECH
  SEmiconductor MAnufacturing TECHnology --半导体制造技术
  美国半导体制造商在1987年成立的一个非赢利的技术开发协会。它的开发计划包括：
  - Advanced Technology; --先进的技术；
  - Advanced Tool Development Facility and Facilities Design --先进的工具开发设备和设备设计；
  - Front-End Processes --前道工艺；
  - Interconnect --互连；
  国际SEMATECH是1998年成立的一个分会，成员包括非美国公司。它的开发计划包括：
  - 300 mm integration and standards --300 mm集成和标准；
  - Environment, Safety and Health (ESH) --环境、安全和健康(ESH)；
  - Lithography --光刻；
  - Manufacturing Methods --制造方法；
  SEMATECH 和国际SEMATECH是由７个国家的14家半导体制造公司组成的，协会位于美国德克萨斯州的奥斯汀，致力于开发最有效的、全球协作的、有影响力的半导体制造技术。SEMATECH和国际SEMATECH与其成员、设备和材料供应商、研究机构、学术界和其它协会一起协作，加速其成员国先进的半导体制造工艺、材料和设备的开发。
  开发的成果在SEMATECH的高级工具开发设备上通过模拟生产线来进行验证。协会的成员可以尽早地获得先进的工具和制造工艺，以及改进设备生产率，从而获益。
• SEMI
  Semiconductor Equipment and Materials Institute --半导体设备与材料学会
• Semiconductor --半导体
  一种材料如硅，其电导率介于导体和绝缘体之间，在高温时电导率几乎像金属一样高，在低温是几乎是零。使用这些特性来制作晶体管和电子器件。
• SERDES
  Serializer/Deserializer --串行器/解串器
• Serial --串行
  与顺序处理的数据或指令有关，一次一位，与并行不同（一次几位）。
• Server --服务器
  一个联网的计算机，为网络中的其它计算机提供信息。使用服务器，使得很多访问者可以访问相同的文件。
• Sewer --下水道
  --将废水和雨水从源头运向处理厂或接受河的通道。
• SFA
  Spectral Flame Analyzers --光谱分析器
• SFC
  polyStyrene Film Capacitor --聚苯乙烯薄膜电容
• SFN
  Signal Frequency Network --单频网络
• SFO
  Shippable Frame Order --可运输的结构定单
• SFN
  Signal Frequency Network --单频网络
• SFV
  Semifinished Variation --半成品的变化
• SG
  Signal Ground --信号接地
• SGA
  Sales General Agreement --销售总协议
• SGML
  Standard Generalized Markup Language --标准通用标记语言
• SGP
  St Genis Pouilly
  --法国东南的小村庄，意法半导体公司总部所在地。
• SGS
  Società Generale Semiconduttori
  --意法半导体的意大利前身公司，1957年在米兰成立，1958年迁到新建的Agrate工厂。
• S/H
  Sample and Hold --采样和保持
• S/N
  Signal to Noise(ratio) --信噪比
• Shared values --共享的价值
  使命、观念、战略指导方针和指导原则，规定公司的目的、为战略和个人行为提供指导。
• Sheet Resistance --薄膜电阻
  薄膜电阻是材料的特性，薄膜电阻的电阻率不是其横截面的函数，用RS表示，单位是欧姆/平方，平方指的是表面面积，没有绝对量纲。
• Shortform catalog --简单的目录
  --每年制作一次的目录，包括意法半导体产品的简单信息。
• SHWL
  Seasonal High Water Level --季节性高水位
• Si
  Silicon --硅
  --四族元素，用于生产二极管、晶体管和集成电路。
• SIA
  Semiconductor Industry Association --半导体工业协会
• SIC
  Standard Industrial Classification --标准工业分类
• SICOM
  (Or ESICOM) --（或ESICOM）
  --从订单到发货，对用户订单进行管理的软件。
• SID
  S-Interface Device -- S接口器件
• Side-brazed Ceramic Package --侧面铜焊陶瓷封装
  --一种多层陶瓷双列直插封装(DIP)，封装的侧面有铜焊外部引线。
• SiGe
  Silicon-Germanium --锗硅
  --半导体IV-IV合金，用作薄层来提高器件的性能。
• Silicides --硅化物
  --金属与硅反应形成的金属－硅化合物，即PtSi（硅化铂）
• Silicon --硅
  --大多数半导体器件中使用的基本元素，半导体器件即二极管、晶体管和集成电路。
• Silicon Dioxide --二氧化硅
  --硅和氧的化合物，在半导体中用于绝缘（隔离）、钝化或掩模层。
• Silicon foundry --硅标准加工厂
  生产其它公司设计的电路的半导体生产商或分部。没有硅生产能力的公司、具有集成电路设计能力的设备制造商和需要更大生产能力的半导体公司，使用硅标准加工厂进行生产。
• Silicon-Gate MOS --硅栅MOS
  --具有淀积多晶硅层形成的栅极的MOS器件。
• Silicon Nitride --氮化硅
  硅和氮的化合物，在处理过程中作为掩模层，或在处理顺序最后作为最终的钝化层。
• SIM
  Subscriber Identification Module --用户识别卡
  存储了GSM蜂窝电话用户详细信息的卡或模块，通过插入这张卡对GSM电话进行编程，因此有卡的用户都可以使用电话。除了用户识别号码和电话号码外，SIM也存有个人的电话号码和各种设置。
• SIMM
  Single Inline Memory Module --单列直插式封装存储器组件
• SIMS
  Secondary Ion Mass Sectroscopy --次极离子质谱分析法
• Simulator --模拟器
  --一种使操作者可以在测试状态下再现或描述实际可能产生情况的设备。
• Simultaneous Engineering --同时设计
  --通过多个功能团队进行新设计的开发，也称作并行设计。
• Singapore --新加坡
  --东南亚的一个国家，有两个意法半导体工厂，Ang Mo Kio和Toa Payoh。
• Single-Crystal --单晶
  --一种具有连续规则晶格结构和没有内部晶界的材料。
• SIO
  Serial Input/Output --串行输入/输出
• SIP
  Single In-line Package --单列直插式封装
  --有一排针（尖桩篱栅形式的），这种封装通常安装在垂直平面上。
• SIPO
  Serial In Parallel Out --串行输入并行输出
• SIR
  Surface Insulation Resistance --表面绝缘电阻
  --确定封装或芯片表面泄露的潮湿试验。
• SITE
  Superfund Innovative Technology Evaluation program --超级资金创新技术评估项目
• Skip testing --跳跃测试
  测试大量集成电路时，为节约时间使用的方法。用探针测试晶片上的小片，如果成品率高于某个规定值，所有的小片都可以安装使用。在最终测试时排除通过晶片测试的坏片。
• SKU
  Stock Keeping Unit --库存单元
• SLC
  Single Layer Ceramic --单层陶瓷
• SLIC
  Subscriber Line Interface Circuit --用户线路接口电路
• SLIP
  Serial Line Internet Protocol --串行线路因特网协议
• Slice --薄片
  Another term for
  --晶片的另一个术语 wafer.
• Sludge --污物块
  用来指大块废物，类似糊状物或软泥，如废水处理中收集的废物。有机物含量高的污物块是城市污水处理厂、食物加工厂、精炼厂和造纸厂产生的。无机物含量高的污物块是工业生产过程产生的。
• SM
  Senior Management --高级管理
  Surface Mount --表面安装
• SMART
  A plan should be S (specific), M (measurable), A (achievable), R (relevant), T (time related). --一个计划应该是明确的（S）、可量度（M）、可以实现（A）、相关（R）、有时间限制（T）。
• Smartcard --智能卡
  智能卡的大小像信用卡，是塑料卡，可以与网络终端设备接口。用于多种用途，包括银行和个人识别应用。智能卡有一个嵌入式的集成电路，通常包括可编程存储器和/或微处理器，智能卡使用中的最大问题是其安全性，数据加密特性保护智能卡不被盗用。
• SmartFinger™
  SmartFinger™ 是一个小型生物测定模块，将指纹识别和屏幕上的导航功能结合起来，用于移动因特网应用。
• SMATV
  Satellite Master Antenna TeleVision --卫星共用天线电视
• SMCL
  Secondary Maximum Contaminant Level --二级最大污染水平
• SMD
  Surface Mount Device --表面安装器件
• SMD
  Solder Mask Defined --焊料掩膜限定的
  --BGA上的球形垫片，比焊工面具开口大。
• SMDS
  Switched Multimegabit Data Service --多兆比特数据交换业务
• S/MIME
  Secured Multipurpose Internet Mail Extension SMTP Simple Mail Transfer Protocol
• SMIP
  Statistical Methods to Improve Performance
• LI>SMOBC
  Solder Mask Over Bare Copper
• Smog
  A general term used to describe any condition in which visibility is reduced because of air pollution. The word is a combination of smoke and fog and was first used in Great Britain when particular atmospheric conditions kept smoke low to the ground in and around London. This kind of smog disappeared when strict rules were introduced on the burning of smokeless fuels in the 1950's. The term is now most commonly used in the context of photochemical smog.
• SMPS
  1) SwitchMode Power Supply
  2) Surface Mount Power Schottky
• SMR
  1) Sales Marketing Representative 2) Surface Mount Resistance
  Test to determine how robust a package is during surface mount soldering.
• SMT
  1) Self-Managing Team
  A Self-Managing Team is a work group that operates with a defined degree of autonomy and without a visible manager.
  A group of employees who are responsible for a "whole" work process or segment that delivers a product or service to an internal or external customer.
  2) Surface Mount Technology
• SN
  Shippers number/serial number
•  
• SNAAQS
  Secondary National Ambient Air Quality Standard
• SNARL
  Suggested No Adverse Response Level
• SNAPHAT
• Term for packaging for ZEROPOWER and TIMEKEEPER products, ST trademark.
• SNG
  Synthetic Natural Gas
• SNMP
  Simple Network Management Protocol
• SNQ
  Service National de la Qualité
• SNR
  Signal to Noise Ratio
• SO
  Small Outline
• SO₂
  Sulphur dioxide
• SOA
  Safe Operating Area
• SOC
  1) System-on-chip
  2) Synthetic Organic Chemicals
• SOD
  Sediment Oxygen Demand
• Soft Bake
  A heat treatment used after the photoresist is applied to the silicon wafer to remove the solvents from the layer.
• Software
  The programs and instructions for a computer.
• SOI
  Silicon On Insulator
  Similar to SOS, but with oxide or another insulting film isolating individual transistors.
• SOIC
  Small Outline Integrated Circuit
• SOJ
  Small Outline, J bend
  An SOIC package with i-bend leads.
• SOLV
  SOLenoid Valve
• SONAR
  SOund NAvigation and Ranging
• SONET
  Synchronous Optical Network
• SOP
  1) Standard Operating Procedure
  2) Small Outline Package
  Typical lead pitch of 50 mils, pin counts from 8 to 32, body width of 150, 200, 300, 330 and 400.
• SOS
  Silicon-On-Sapphire.
  A fast MOS technology in which silicon is epitaxially grown on a sapphire wafer, and etched away between transistors. Each device is thus isolated by air or oxide from other devices.
• SOT
  Small Outline Transistor
• Source
  The working-current terminal of an FET that is a source for holes (P-channel) or free electrons (N-channel) flowing in the channel. Corresponds to emitter of bipolar transistors.
• SOW
  Statement of Work
  The statement of work is a document listing the work and services that must be accomplished in order to reach the objectives of a program.
• SOx
  Sulphur oxides
• SP
  1) Signal Processor
  2) Stack Pointer
• SPARC
  Scalable Processor Architecture
• SPC
  Statistical Process Control
  The conversion of data to information using statistical techniques to document, correct, and improve process performance (use of statistical techniques, such as control charts, to control a process). A process is said to be in state of Statistical Control if the variations among the sampling results can be attributed to a constant system of common causes.
• SPCC Plan
  Spill Prevention Control and Countermeasure Plan
• SPD
  Serial Presence Detect
• SPDS
  Smart Power Development System
  Application development tool developed by ST for smart power integrated circuits. Consists of PC hardware and software.
• SPDT
  Single Pole Double Throw (switch)
• SPE
  Secondary Particulate Emissions
• SPEC
  Specification
  A document which should include, for a given manufacturing process:
  - A description of the process (product, raw materials, equipment, conditions of use)
  - All necessary indications for performing the operation.
  It is also a customer specification.
• Special Causes
  A factor contributing to the variation in quality that is possible to detect and identify. Also referred to as Unnatural Variation.
• Spent Resin
  The most significant waste, in terms of quantities, which back-end sites currently produce. The waste is generated in the molding processes, being the excess resin left in the molds after molding. Since these resins are thermosetting plastic, they cannot be melted and re-used as can often be done with the excess plastics generated in molding processes. Currently, these wastes are all being sent to landfill. Finding some other use for these spent resins is one of the back-ends' major technical challenges to meet the Decalogue's commitment. Various projects are in hand, notably to evaluate if the spent resins can be used in road-beds as a substitute for the materials currently used.
• SPG
  Subsystem Products Group
  ST organization responsible for subsystem products such as power supply modules. It was created in April 1994 when Subsystem and RF activities of the former Subsystems & Radio Frequency (SRF) group were separated.
• SPI
  1) Serial Peripheral Interface
  2) Serial to Parallel Interface
• SPICE
  Simulation Program with Integrated Circuit Emphasis
• Spider Bonding
  A method of connecting an integrated circuit die to its package leads. A leadframe is placed over the chip and all connections are made by just one operation of a bonding machine. Tape automated bonding (TAB) uses this approach to interconnection.
• Spill
  Any unplanned discharge or release of hazardous waste onto or into the land, air, or water.
• Spin or Spinning
  The process used to apply the photoresist to the wafer
• SPL
  Sound Pressure Level
• Split
  A term used in the Semiconductor Productivity Network system (SPN), meaning to break up or divide a batch.
• SPN
  Semiconductor Productivity Network.
  A Computer Aided Manufacturing (CAM) system used in several of ST Back-End production sites.
• Spore
  Singapore
• Spreading Resistance
  A technical evaluation used to measure the dopant profile of a p-n junction.
• SPST
  Single Pole Single Throw
• Sputtering
  A method of depositing a film of material on an IC wafer. A target of the desired material is bombarded with excited ions that knock atoms from the target, which are then deposited on the wafer
• SQC
  Statistical Quality Control
  Statistical methods and procedures used to document and assure compliance with requirements.
• SQFP
  Shrink Quad Flat Pack
• SQG
  Small Quantity Generator
• SQL
  Structured Query Language
• SR
  Shift Register
• SRAM
  Static Random Access Memory
  A volatile memory, which uses little energy and retains its memory without the need for refreshing, as long as power is applied.
• SRC
  Solvent-Refined Coal
• SRF
  Subsystems and Radio Frequency
  Former ST organization that was responsible for all subsystem products (such as power supply modules) and radio frequency components. Previously it was also called SERF (in Italian "E" means "and"). In April 1994 the RF part was transferred to Discrete & Standard circuits Group (DSG) and the subsystems part became the Subsystem Products Group (SPG).
• SRM
  Standard Reference Method
• SRS
  SurRound Sound
• SRW
  Simultaneous Read/Write
• SS
  Suspended Solids
• SSA
  1)
  Sales Service Assistant
  2)
  Sole Source Aquifer
• SSB
  Single Side Bank
• SSD
  Silicon System Design
  Independent IC design house based in Dublin, Ireland.
• SSI
  1) Small Scale Integration
  ICs containing fewer than 30 transistors.
  2) Synchronous Serial Interface
• SSL
  Secured Socket Layer
• SSM
  Supplier Sales Manager
• SSOP
  Shrink Small Outline Package
• SSP
  Synchronous Serial Port
• SSPM
  1) Super Speed Power Motor
  2) Scalar System Memory
• SSR
  Solid State Rectifier
• SSS
  Sales Support Specialist
• SSTV
  Slow Scan TV
• ST
  STMicroelectronics
• st.com
  The domain name for ST on the Internet. The address "/stonline/index.htm" is ST's home page on the world wide web.
• Staff
  In ST jargon a manager's staff are the first level of people reporting to our CEO. A staff-level position means that the holder is considered part of the manager's staff even if they report to another person. A staff function is one not directly concerned with the operations of the Company, for example Public Relations, Human Resources and so on.
• Stakeholders
  All those constituencies who have a legitimate concern for the performance of the company - i.e. shareholders, customers, employees, suppliers and local communities.
• Standard Cells
  Predefined logic elements that may be selected and arranged to create a custom IC more easily than through original (custom) design.
• Standard Deviation
  A measure of the dispersion of a set of values within a distribution. It is usually designated by the Greek letter sigma (standard deviation of a whole population) or by Sx (standard deviation of a sample of observations from a population).
• Standard margin
  Profit remaining after deducting from sales the cost of products at WWS (WorldWide Standard costs).
• STAPI
  ST Application Programming Interface
• STAR
  STMicroelectronics Advanced Risc division
• STAR
  ST Audio and Radio Converters
• Static RAM (SRAM)
  A type of semiconductor memory in which a pair of flip-flops are cross-coupled to hold a binary state as long as power is applied.
• STB
  Set top box
• ST Debt
  Short Term Debt
• Std/STD
  Standard
• 
  Steam Oxide
  The use of high-temperature water vapor to grow silicon dioxide. The source of water vapor can be from D.I. water or the pyrogenic reaction of hydrogen (H2) and oxygen(02)
• STEL
  Short Term Exposure Limit
• STEM
  Scanning Transmission Electronic Microscope
• Step-And-Repeat Camera
  An optical system that reduces an enlarged reticle image to 1X on a master plate.
  After each exposure, the master plate is stepped to a new position and the exposure process is repeated.
• Step Coverage
  The thickness of a thin film over topological changes relative to the thickness on the top surface.
• Stepping Aligner
  An optical system that projects (usually 5X or 1OX) reticle images on a portion of the photoresist-coated wafer. After exposure, the wafer is stepped to a new position and the exposure process is repeated.
• Sticky foil
  Thin film of plastic coated with adhesive. When a silicon wafer is cut into dice it is placed on a sticky foil to hold the separate dice together until they are attached to the leadframe.
• STM
  STMicroelectronics share as named in the New York Stock Exchange.
• STNET
  ST Network
  The company's internal computer communications network. It is connected to Internet through security firewall computers.
• STOPAC
  Stratospheric Ozone Protection Advisory Committee (of the US. EPA)
• STP
  Standard Temperature and Pressure
• STPP
  Sodium tripolyphosphate
• STPR
  ST Power Rectifiers
• STPS
  ST Power Schottky
• Stratosphere
  The second layer of the atmosphere above the Earth. The air surrounding the Earth consists of distinct zones, distinguished by the temperature gradient within each layer. The stratosphere begins at about 11 kilometers of altitude and extends up to about 50 kilometers. The air temperature in this layer generally increases as altitude increases. The ozone layer of the atmosphere is located within the stratosphere.
• Stretch Goals
  Goals that are impossible to reach through small improvements. The entire solution concept has to be changed to be able to reach the goal.
• STripFET
  Devices that utilize a single feature size process based on ST's patented strip layout technique that needs fewer process steps. Its only critical parameter is the width of the strip, which depends solely on the equipment resolution.
• Stripping
  The process of completely removing a coating such as photoresist.
• STS
  Ship-To-Stock
• STTA
  ST Turboswitch
• STU
  ST-University
  Created in 1994 with merger of research and training functions. Based at Rousset, in France, close to Aix en Provence.
• STVIN
  ST Voice Integrated Network
  The Company's private international telephone network previously in place before installing TINA.
• Subcollector
  See Buried Layer
• Submicron
  Describes any integrated circuit process producing features smaller than one micron.
• Sulphates (SO4-2)
  The most common ionic form of Sulphur oxides. In the atmosphere, sulphates can be present as small-diameter aerosols of solid sulfate salts (e.g., ammonium sulfate) or small droplets of sulphuric acid. Sulfates are an inhalation hazard and an important contributor to acid deposition. In the soil, sulphates serve as plant nutrients when present in appropriate concentrations. In salt marshes, sulphates can be a precursor for the microbial production of hydrogen sulfide. If sulphates are discharged in too great quantities in surface waters they can increase to unacceptable levels the amount of dissolved solids in the water (i.e., its "saltiness").
• Sulphur dioxide (SO2)
  A compound of sulfur containing one sulfur atom and two oxygen atoms. This compound is emitted naturally during volcanic eruptions, and is naturally present in the atmosphere in very low concentrations. It is also a major air pollutant produced by the burning of sulphur-containing compounds, the most significant of which are coal and oil containing high levels of sulphur-containing organic compounds. Sulphur dioxide has a strong odor and is very irritant. An excess concentration of sulphur dioxide is a major cause of acid rain and other acid deposition. Sulphur dioxide is often included in the general term sulphur oxides, SOx, along with sulphur trioxide, SO3. Sulphur oxides are often cited as "SOX".
• Sulphuric acid (H2SO4)
  A strong, highly corrosive acid. It is a colorless, oily liquid that is a strong dehydrating and oxidizing agent. The acid is a widely used industrial chemical and is formed in the atmosphere from emissions of sulphur dioxide and sulphur trioxide. It is used to clean silicon wafers and remove photoresist.
• SuperBGA
  Thin (1.2 mm) cavity down BGA from Anam. Trademarked name often (wrongly) used generically.
• SuperH™
  A family of RISC microprocessor cores produced by SuperH, Inc. an independant company founded by ST and Hitachi.
  
• Supply Management
  The systematic management of the suppliers through closer co-operation with key suppliers.
• SURE
  A published booklet describing our TQC program and commitment to our customers.
• Surface Waters
  A term used to cover any body of water which is to be found at the Earth's surface, hence streams, torrents, rivers, canals, lakes, reservoirs, marshes, deltas, seas, oceans, etc.
• SUS
  Silicon Unilateral Switch
• Susceptor
  A plate on which semiconductor wafers are heated during thermal processes such as epitaxy and chemical vapor deposition (CVD).
• Sustainable Development
  A form of economic development which has been summed up in the following phrase: " Sustainable development satisfies present needs without compromising the possibility of future generations to satisfy their own needs".
  The concept of sustainable development was formalized in 1987 by the United Nations World Commission on Environment and Development, often known as the Brundtland Commission after its Chairman Mrs. Gro Harlem Brundtland who prior to this chairmanship was Prime Minister of Norway.
  The concept has become the basis of most international and national environmental policies since then, starting from the 1992 Unites Nations World Environment Conference (often known as the Earth Summit). In particular, the International Chamber of Commerce has created a Business Charter for Sustainable Development (which ST has signed).
• System-on-Chip (SOC)
  Advanced semiconductor manufacturing techniques result in silicon chips with millions of transistors available, which makes it possible to put different types of functions on the same chip. So a complete system, including micro-processors, memory, analog and power, can be built to put the system on a single chip.
• Symbolize
  Semiconductor jargon meaning to mark a product with part number, logo and other information.
• SW
  1) Software
  2) Short Wave
• SWD
  1) Software WatchDog
  2) SoftWare Device
• SWDA
  Solid Waste Disposal Act
• SWEAT
  Standard Water Level Electromigration Accelerated Test